Title :
Single trench isolation for a 650 V SOI technology with low mechanical stress
Author :
Kittler, G. ; Lerner, R. ; Eckoldt, U. ; Schottmann, K. ; Fritzsch, M. ; Schramm, M. ; Erler, K. ; Heinz, S. ; Horstmann, J.T.
Author_Institution :
X-FAB Semicond. Foundries AG, Erfurt, Germany
Abstract :
The successful optimization and characterization of a deep trench isolation in a thick SOI process for operating voltages up to 650 V is reported. Different technologies were investigated to optimize the mechanical stress during wafer processing and to increase the breakdown voltage of a single trench configuration. Comprehensive electrical characterization was done to investigate achievable operating conditions and related reliability issues for thick oxide trench isolation layers. The most promising trench technology was choosen as a modular extension to an existing 650 V SOI BCD process.
Keywords :
electric breakdown; integrated circuit reliability; isolation technology; optimisation; silicon-on-insulator; SOI BCD process; SOI technology; breakdown voltage; deep trench isolation; low mechanical stress; optimization; reliability; single trench isolation; voltage 650 V; wafer processing; Current measurement; Electric breakdown; Leakage current; Stress; Temperature; Transmission line measurements; Voltage measurement;
Conference_Titel :
SOI Conference (SOI), 2010 IEEE International
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-9130-8
Electronic_ISBN :
1078-621x
DOI :
10.1109/SOI.2010.5641368