DocumentCode :
3174007
Title :
Generalized PolyCube Trivariate Splines
Author :
Li, Bo ; Li, Xin ; Wang, Kexiang ; Qin, Hong
Author_Institution :
Dept. of Comput. Sci., Stony Brook Univ. (SUNY), Stony Brook, NY, USA
fYear :
2010
fDate :
21-23 June 2010
Firstpage :
261
Lastpage :
265
Abstract :
This paper develops a new trivariate hierarchical spline scheme for volumetric data representation. Unlike conventional spline formulations and techniques, our new framework is built upon a novel parametric domain called Generalized PolyCube (GPC), comprising a set of regular cubes being glued together. Compared with the conventional PolyCube (PC) that could serve as a "one-piece\´\´ 3-manifold domain, GPC has more powerful and flexible representation ability. We develop an effective framework that parameterizes a solid model onto a topologically equivalent GPC domain, and design a hierarchical fitting scheme based on trivariate T-splines. The entire data-spline-conversion modeling framework provides high-accuracy data fitting and greatly reduce the number of superfluous control points. It is a powerful toolkit with broader application appeal in shape modeling, engineering analysis, and reverse engineering.
Keywords :
data structures; reverse engineering; solid modelling; splines (mathematics); data-spline-conversion modeling framework; engineering analysis; generalized PolyCube trivariate splines; hierarchical fitting scheme design; high-accuracy data fitting; reverse engineering; shape modeling; solid model parameter; trivariate T-splines; trivariate hierarchical spline scheme; volumetric data representation; Algorithm design and analysis; Computer industry; Computer science; Data engineering; Mechanical splines; Power engineering and energy; Reverse engineering; Shape; Solid modeling; Topology; Generalized PolyCube; Trivariate Spline; Volumetric Parameterization;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Shape Modeling International Conference (SMI), 2010
Conference_Location :
Aix-en-Provence
Print_ISBN :
978-1-4244-7259-8
Electronic_ISBN :
978-1-4244-7260-4
Type :
conf
DOI :
10.1109/SMI.2010.40
Filename :
5521474
Link To Document :
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