Professional development courses for the 65th ECTC

Author

Pearsall, Kitty ; Suhling, Jeffrey ; Kobeda, Eddie ; Puttlitz, Albert F. ; Reynolds, Tom

fYear

2015

fDate

26-29 May 2015

Firstpage

1

Lastpage

1

Abstract

Summary form only given. Paper covers the following topics: lead-free solder joints; fan-out wafer level packaging; package failure analysis; ultra-small smart mobile; wearable systems; medical systems; IoT systems; polymers; nanocomposites; electronic packaging; photonic packaging; integrated thermal packaging; power electronics reliability; electronic packaging; interposers; flip chip technologies; wafer level chip scale packaging; microelectronic package reliability; IC package yield; package failure mechanisms; 3D IC integration; and 3D IC packaging.

Keywords

failure analysis; flip-chip devices; integrated circuit reliability; power integrated circuits; solders; three-dimensional integrated circuits; wafer level packaging; 3D IC integration; 3D IC packaging; IC package yield; IoT systems; electronic packaging; fan-out wafer level packaging; flip chip technologies; integrated thermal packaging; interposers; lead-free solder joints; medical systems; microelectronic package reliability; nanocomposites; package failure analysis; package failure mechanisms; photonic packaging; polymers; power electronics reliability; ultra-small smart mobile; wafer level chip scale packaging; wearable systems; Continuing education; Electronic packaging thermal management; Electronics packaging; Packaging; Plastics; Semiconductor device reliability;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th

Conference_Location

San Diego, CA

Type

conf

DOI

10.1109/ECTC.2015.7159555

Filename

7159555