Title :
Hybrid silicon lasers: Integration of III–V and silicon photonics using wafer bonding
Author :
Jones, R. ; Park, H. ; Fang, A.W. ; Sysak, M. ; Koch, B. ; Liang, D. ; Chang, H. ; Bowers, J.E.
Author_Institution :
Intel Corp, Santa Clara, CA, USA
Abstract :
This talk will give an overview of the hybrid silicon laser device platform which heterogeneously integrates InP with SOI to fabricate silicon photonic chips with integrated lasers. Challenges associated with this integration will be discussed as well as examples of integrating hybrid silicon lasers with other silicon photonic components on the path to achieving a terabit silicon photonic link.
Keywords :
III-V semiconductors; elemental semiconductors; indium compounds; integrated optics; quantum well lasers; reviews; silicon; silicon-on-insulator; wafer bonding; InP-Si; SOI; hybrid silicon laser device; integrated photonics; lll-V photonics; terabit silicon photonic link; wafer bonding; Laser excitation; Laser mode locking; Measurement by laser beam; Photonics; Pump lasers; Semiconductor waveguides;
Conference_Titel :
SOI Conference (SOI), 2010 IEEE International
Conference_Location :
San Diego, CA
Print_ISBN :
978-1-4244-9130-8
Electronic_ISBN :
1078-621x
DOI :
10.1109/SOI.2010.5641405
