DocumentCode
3174543
Title
Hybrid silicon lasers: Integration of III–V and silicon photonics using wafer bonding
Author
Jones, R. ; Park, H. ; Fang, A.W. ; Sysak, M. ; Koch, B. ; Liang, D. ; Chang, H. ; Bowers, J.E.
Author_Institution
Intel Corp, Santa Clara, CA, USA
fYear
2010
fDate
11-14 Oct. 2010
Firstpage
1
Lastpage
2
Abstract
This talk will give an overview of the hybrid silicon laser device platform which heterogeneously integrates InP with SOI to fabricate silicon photonic chips with integrated lasers. Challenges associated with this integration will be discussed as well as examples of integrating hybrid silicon lasers with other silicon photonic components on the path to achieving a terabit silicon photonic link.
Keywords
III-V semiconductors; elemental semiconductors; indium compounds; integrated optics; quantum well lasers; reviews; silicon; silicon-on-insulator; wafer bonding; InP-Si; SOI; hybrid silicon laser device; integrated photonics; lll-V photonics; terabit silicon photonic link; wafer bonding; Laser excitation; Laser mode locking; Measurement by laser beam; Photonics; Pump lasers; Semiconductor waveguides;
fLanguage
English
Publisher
ieee
Conference_Titel
SOI Conference (SOI), 2010 IEEE International
Conference_Location
San Diego, CA
ISSN
1078-621x
Print_ISBN
978-1-4244-9130-8
Electronic_ISBN
1078-621x
Type
conf
DOI
10.1109/SOI.2010.5641405
Filename
5641405
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