Title :
Precise RLGC modeling and analysis of through glass via (TGV) for 2.5D/3D IC
Author :
Jihye Kim ; Insu Hwang ; Youngwoo Kim ; Jonghyun Cho ; Sundaram, Venky ; Tummala, Rao ; Joungho Kim
Author_Institution :
Terahertz Interconnection & Package Lab., KAIST, Daejeon, South Korea
Abstract :
Through glass via (TGV) is most important technology in the glass interposer. Electrical characteristic of TGV determines the overall signal integrity of signal paths in 2.5D/3D system. It is essential to electrically model TGVs for analysis of overall 2.5D/3D IC system including digital or analog chip. In this paper, we proposed the precise RLGC circuit model of single-ended signal TGV. Each equation of RLGC is a function of design parameters such as height, diameter of through glass via and pitch between GS pair, and material properties such as permittivity of glass and polymer. Proposed model is verified up to 40GHz with full-3D simulation. Using the proposed model with parasitic components of through glass via, we analyzed the electrical characteristic of TGV in frequency and time domain.
Keywords :
RLC circuits; analogue circuits; digital circuits; glass; integrated circuit interconnections; three-dimensional integrated circuits; vias; 2.5D IC; 3D IC; RLGC circuit model; TGV; analog chip; digital chip; glass interposer; through glass via; Capacitance; Glass; Inductance; Insertion loss; Integrated circuit modeling; Mathematical model; Polymers;
Conference_Titel :
Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
Conference_Location :
San Diego, CA
DOI :
10.1109/ECTC.2015.7159601
