• DocumentCode
    3175880
  • Title

    An SOI technology optimized ASIC design system

  • Author

    Zuchowski, Paul S. ; Bentlage, Susan M. ; Kuemerle, Mark W.

  • Author_Institution
    IBM Corp., Burlington, VT, USA
  • fYear
    2010
  • fDate
    11-14 Oct. 2010
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    Silicon on insulator (SOI) technology is an excellent choice for chip designs that require high performance and low power. IBM´s SOI custom logic (ASIC) design system uses internal tools and flows in combination with solutions from a network of proven EDA vendors to support these high performance designs while managing the additional complexities introduced by the SOI process. The use of a qualified design system can add schedule predictability while simultaneously achieving high performance and power predictability. In this paper, we describe a high performance methodology for custom designs using a combination of Cadence, Synopsys, and IBM tools and flows. We discuss the benefits and challenges of the SOI technology and share results of high performance designs that were successfully manufactured using this methodology.
  • Keywords
    application specific integrated circuits; integrated circuit design; logic design; silicon-on-insulator; ASIC design system; EDA vendors; SOI technology; application specific integrated circuits; chip designs; silicon on insulator; Clocks; History; IP networks; Logic gates; Semiconductor process modeling; Silicon on insulator technology; Timing; application specific integrated circuits; custom logic; design system; power; silicon on insulator; very-large-scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    SOI Conference (SOI), 2010 IEEE International
  • Conference_Location
    San Diego, CA
  • ISSN
    1078-621x
  • Print_ISBN
    978-1-4244-9130-8
  • Electronic_ISBN
    1078-621x
  • Type

    conf

  • DOI
    10.1109/SOI.2010.5641485
  • Filename
    5641485