Title :
Evaluation of the impact of mechanical stress on CMOS device mismatch
Author :
Schaper, Ulrich ; Linnenbank, Carsten ; Kollmer, Ute ; Mulatz, Hans ; Mensing, Tobias ; Schmidt, Roland ; Tilgner, Rainer ; Thewe, Roland
Author_Institution :
Infineon Technol. AG, Munich, Germany
Abstract :
Mechanical stress occurs during packaging and front-end processing. The impact of mechanical stress on device mismatch is investigated. A measurement set-up is presented which uses a beam bending technique to apply mechanical stress. The characterization of mismatch is based on a test macro for the extraction of pair mismatch and long distance mismatch. It is found that the device characteristics change when stress is applied dependent on the device orientation with respect to the stress direction. 0.18 μm, 0.25 μm, and 0.50 μm technologies are investigated. No major impact is observed on the pair-mismatch of directly neighboring devices and on the long distance mismatch due to mechanical stress
Keywords :
CMOS integrated circuits; bending; integrated circuit packaging; integrated circuit testing; internal stresses; stress analysis; 0.1 micron; 0.25 micron; 0.5 micron; CMOS device mismatch; beam bending technique; device characteristics change; device mismatch; device orientation; directly neighboring devices; front-end processing; long distance mismatch; measurement set-up; mechanical stress; packaging; pair mismatch; pair-mismatch; stress application; stress direction; test macro; CMOS technology; Electric variables measurement; Electrical resistance measurement; Mechanical variables measurement; Packaging; Resistors; Silicon; Stress measurement; Testing; Voltage;
Conference_Titel :
Microelectronic Test Structures, 2001. ICMTS 2001. Proceedings of the 2001 International Conference on
Conference_Location :
Kobe
Print_ISBN :
0-7803-6511-9
DOI :
10.1109/ICMTS.2001.928627
