FC Cu pillar package development for broad market applications

Over recent years, Flip Chip Technology has gained significant momentum as a major assembly technology for the semiconductor industry. And momentum is increasing as there is a strong need to expand flip chip applications to align with an evolving and dynamic market. As a result, our industry has seen many different configurations of FC packaging, and is constantly pushing boundaries and innovation to meet complex device requirements. This paper describes the development of a new generation of Flip Chip CSP (chip scale package) drawing from innovation from assembly and material techniques. While build up substrate has been very effective, laminate substrate with bond on trace design, together with Cu pillar solder tip assembly process design, has significant lower cost for FC CSP assembly.