Title :
Active and passive integration on flexible glass substrates: Subtractive single micron metal interposers and high performance IGZO thin film transistors
Author :
Malay, Robert ; Nandur, Abhishek ; Hewlett, Joshua ; Vaddi, Rajesh ; White, Bruce E. ; Poliks, Mark D. ; Garner, Sean M. ; Ming-Huang Huang ; Pollard, Scott C.
Author_Institution :
Center for Adv. Microelectron. Manuf. (CAMM), State Univ. of New York at Binghamton, Binghamton, NY, USA
Abstract :
Flexible glass is one of the most promising innovations in the 21st century. Its applications in roll-to-roll (R2R) based manufacturing can yield low cost, conformable, and transparent electronics. In this work, we introduce electronic interposer substrates consisting of multiple metal-insulator layers of subtractively processed single micron metal circuit lines as well as high performance IGZO thin film transistors fabricated on Corning® Willow® Glass. All processes are compatible with R2R patterning and fabrication.
Keywords :
flexible electronics; gallium compounds; glass; indium compounds; metal-insulator boundaries; thin film transistors; Corning Willow glass; InGaZnO; R2R based manufacturing; active integration; electronic interposer substrates; flexible glass substrates; high performance IGZO thin film transistors; multiple metal-insulator layers; passive integration; roll-to-roll based manufacturing; single micron metal circuit lines; subtractive single micron metal interposers; Adhesives; Copper; Dielectrics; Glass; Substrates; Thin film transistors;
Conference_Titel :
Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
Conference_Location :
San Diego, CA
DOI :
10.1109/ECTC.2015.7159667
