Active and passive integration on flexible glass substrates: Subtractive single micron metal interposers and high performance IGZO thin film transistors

Author

Malay, Robert ; Nandur, Abhishek ; Hewlett, Joshua ; Vaddi, Rajesh ; White, Bruce E. ; Poliks, Mark D. ; Garner, Sean M. ; Ming-Huang Huang ; Pollard, Scott C.

Author_Institution

Center for Adv. Microelectron. Manuf. (CAMM), State Univ. of New York at Binghamton, Binghamton, NY, USA

fYear

2015

fDate

26-29 May 2015

Firstpage

691

Lastpage

699

Abstract

Flexible glass is one of the most promising innovations in the 21st century. Its applications in roll-to-roll (R2R) based manufacturing can yield low cost, conformable, and transparent electronics. In this work, we introduce electronic interposer substrates consisting of multiple metal-insulator layers of subtractively processed single micron metal circuit lines as well as high performance IGZO thin film transistors fabricated on Corning® Willow® Glass. All processes are compatible with R2R patterning and fabrication.

Keywords

flexible electronics; gallium compounds; glass; indium compounds; metal-insulator boundaries; thin film transistors; Corning Willow glass; InGaZnO; R2R based manufacturing; active integration; electronic interposer substrates; flexible glass substrates; high performance IGZO thin film transistors; multiple metal-insulator layers; passive integration; roll-to-roll based manufacturing; single micron metal circuit lines; subtractive single micron metal interposers; Adhesives; Copper; Dielectrics; Glass; Substrates; Thin film transistors;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th

Conference_Location

San Diego, CA

Type

conf

DOI

10.1109/ECTC.2015.7159667

Filename

7159667