Signal and power integrity analysis in 2.5D integrated circuits (ICs) with glass, silicon and organic interposer

2.5D integration using interposer and through via technologies is one of the promising solutions to enable systems with higher electrical performance and at the same time reducing size of the whole systems. To maximize benefits of the interposer, power distribution network (PDN) and channels should be well-designed. PDN and channel properties are heavily affected by the material properties of the interposer substrate. Depending on the substrate material, anti-resonance frequency of PDN can coincide with ICs´ switching frequencies. Therefore analysis and comparison of hierarchical PDN are important. Also channels can be affected by the PDN design, especially channels escaping/entering interposers are affected by the properties of the interposer PDN. Therefore, when designing interposers, co-design and co-analysis of PDNs and channels are required.