DocumentCode
3176350
Title
Accurate CPM based early design stage SERDES PDN optimization in mobile platform
Author
Yongho Lee ; Sanggwoun Lee ; Jaehyun Park ; Jaemin Shin
Author_Institution
Syst. LSI, Samsung, Hwaseong, South Korea
fYear
2015
fDate
26-29 May 2015
Firstpage
744
Lastpage
747
Abstract
As the demand of faster data rate and power domain sharing for smaller design area increases, power integrity (PI) gets more vulnerable to self and transfer noises. So it is crucial to analyze the overall PDN requirement for reliable system before fabrication. However, the traditional approach using transistor-level analysis could not be applied for a comprehensive analysis due to limited analysis turn-around time. This paper addresses a novel methodology of power delivery network (PDN) co-optimization from chip to board in early design stage to make sure the PDN quality. Accurate CPM (chip power model) is introduced to overcome the simulation time limitation. Novel design optimization method is proposed to get optimal design parameters under the given constraints. Using the proposed methodology, overall PDN design optimization process has been demonstrated with practical examples. In this case study, package design is enhanced by up to ~ 30% inductance improvement and the number of board decoupling capacitors ~ 80% reduction after design optimization.
Keywords
integrated circuit design; integrated circuit interconnections; integrated circuit noise; integrated circuit packaging; optimisation; transistor circuits; CPM; SERDES PDN optimization; chip power model; comprehensive analysis; data rate; decoupling capacitor; early design stage; inductance improvement; mobile platform; package design; power delivery network cooptimization; power domain sharing; power integrity; transfer noise; transistor-level analysis; Analytical models; Capacitors; Design optimization; Impedance; Noise; Switches; chip power model; chip-package-board; co-optimization; early design stage; power delivery network;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
Conference_Location
San Diego, CA
Type
conf
DOI
10.1109/ECTC.2015.7159674
Filename
7159674
Link To Document