DocumentCode :
3176397
Title :
SEM PACKAGING OF ADVANCED MODULAR AVIONICS
Author :
Nerius, K.
fYear :
1995
fDate :
5-9 Nov 1995
Firstpage :
287
Keywords :
Aerospace electronics; Aircraft; Assembly; Backplanes; Bonding; Connectors; Electronics packaging; Heat sinks; Integrated circuit interconnections; Protection;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Digital Avionics Systems Conference, 1995., 14th DASC
Print_ISBN :
0-7803-3050-1
Type :
conf
DOI :
10.1109/DASC.1995.482842
Filename :
482842
Link To Document :
https://search.ricest.ac.ir/dl/search/defaultta.aspx?DTC=49&DC=3176397
