• DocumentCode
    3176405
  • Title

    Determining the inductance of a through-substrate via using multiple on-wafer test approaches

  • Author

    Uscola, Ric ; Tutt, Marcel

  • Author_Institution
    DigitalDNA Labs., Motorola Inc., Tempe, AZ, USA
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    147
  • Lastpage
    151
  • Abstract
    Four on-wafer measurement approaches for determining the inductance, Lvia, of through-substrate vias used in gallium arsenide (GaAs) monolithic microwave integrated circuits (MMICs) have been implemented and compared. All of the approaches yielded similar results, enabling an accurate estimate for Lvia. The implementations, advantages, and disadvantages of each approach are compared
  • Keywords
    III-V semiconductors; MMIC; gallium arsenide; inductance; integrated circuit interconnections; integrated circuit metallisation; integrated circuit testing; GaAs; GaAs MMICs; estimation accuracy; gallium arsenide monolithic microwave integrated circuits; inductance; multiple on-wafer test approaches; on-wafer measurement; through-substrate via; Capacitors; Circuit testing; Frequency measurement; Gallium arsenide; Inductance measurement; Microstrip; Microwave integrated circuits; Probes; Through-silicon vias; Transmission line measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Microelectronic Test Structures, 2001. ICMTS 2001. Proceedings of the 2001 International Conference on
  • Conference_Location
    Kobe
  • Print_ISBN
    0-7803-6511-9
  • Type

    conf

  • DOI
    10.1109/ICMTS.2001.928653
  • Filename
    928653
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3176405