• DocumentCode
    3176891
  • Title

    Plasma doping: theoretical simulation and use of safer gas

  • Author

    Chu, Paul K.

  • Author_Institution
    Dept. of Phys. & Mater. Sci., City Univ. of Hong Kong, Kowloon, China
  • fYear
    2000
  • fDate
    6-6 Dec. 2000
  • Firstpage
    35
  • Lastpage
    40
  • Abstract
    Plasma doping (PD) is an alternative technique to form shallow junctions in deep sub-micrometer microelectronic devices. The use of theoretical simulation to derive the energy distribution of implanted ions can lessen the time required for design of PD experiments and recipes. It also provides useful information on the dopant depth profiles. The second part of the paper describes the use of a boron-containing gas that is much less toxic than diborane to form shallow junctions.
  • Keywords
    doping profiles; health hazards; integrated circuit technology; plasma materials processing; safety; semiconductor doping; semiconductor process modelling; B; PD experiment design; PD recipe design; boron-containing gas; diborane; dopant depth profiles; gas toxicity; implanted ion energy distribution; microelectronic devices; plasma doping; safer dopant gas usage; shallow junction formation; simulation; Acceleration; Doping; Electrons; Plasma accelerators; Plasma immersion ion implantation; Plasma measurements; Plasma simulation; Rapid thermal annealing; Silicon; Voltage;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Junction Technology, 2000, The first international workshop on, Extended abstracts of
  • Conference_Location
    Makuhari, Japan
  • Print_ISBN
    4-89114-008-9
  • Type

    conf

  • DOI
    10.1109/IWIT.2000.928774
  • Filename
    928774