DocumentCode :
3176891
Title :
Plasma doping: theoretical simulation and use of safer gas
Author :
Chu, Paul K.
Author_Institution :
Dept. of Phys. & Mater. Sci., City Univ. of Hong Kong, Kowloon, China
fYear :
2000
fDate :
6-6 Dec. 2000
Firstpage :
35
Lastpage :
40
Abstract :
Plasma doping (PD) is an alternative technique to form shallow junctions in deep sub-micrometer microelectronic devices. The use of theoretical simulation to derive the energy distribution of implanted ions can lessen the time required for design of PD experiments and recipes. It also provides useful information on the dopant depth profiles. The second part of the paper describes the use of a boron-containing gas that is much less toxic than diborane to form shallow junctions.
Keywords :
doping profiles; health hazards; integrated circuit technology; plasma materials processing; safety; semiconductor doping; semiconductor process modelling; B; PD experiment design; PD recipe design; boron-containing gas; diborane; dopant depth profiles; gas toxicity; implanted ion energy distribution; microelectronic devices; plasma doping; safer dopant gas usage; shallow junction formation; simulation; Acceleration; Doping; Electrons; Plasma accelerators; Plasma immersion ion implantation; Plasma measurements; Plasma simulation; Rapid thermal annealing; Silicon; Voltage;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Junction Technology, 2000, The first international workshop on, Extended abstracts of
Conference_Location :
Makuhari, Japan
Print_ISBN :
4-89114-008-9
Type :
conf
DOI :
10.1109/IWIT.2000.928774
Filename :
928774
Link To Document :
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