DocumentCode
3176891
Title
Plasma doping: theoretical simulation and use of safer gas
Author
Chu, Paul K.
Author_Institution
Dept. of Phys. & Mater. Sci., City Univ. of Hong Kong, Kowloon, China
fYear
2000
fDate
6-6 Dec. 2000
Firstpage
35
Lastpage
40
Abstract
Plasma doping (PD) is an alternative technique to form shallow junctions in deep sub-micrometer microelectronic devices. The use of theoretical simulation to derive the energy distribution of implanted ions can lessen the time required for design of PD experiments and recipes. It also provides useful information on the dopant depth profiles. The second part of the paper describes the use of a boron-containing gas that is much less toxic than diborane to form shallow junctions.
Keywords
doping profiles; health hazards; integrated circuit technology; plasma materials processing; safety; semiconductor doping; semiconductor process modelling; B; PD experiment design; PD recipe design; boron-containing gas; diborane; dopant depth profiles; gas toxicity; implanted ion energy distribution; microelectronic devices; plasma doping; safer dopant gas usage; shallow junction formation; simulation; Acceleration; Doping; Electrons; Plasma accelerators; Plasma immersion ion implantation; Plasma measurements; Plasma simulation; Rapid thermal annealing; Silicon; Voltage;
fLanguage
English
Publisher
ieee
Conference_Titel
Junction Technology, 2000, The first international workshop on, Extended abstracts of
Conference_Location
Makuhari, Japan
Print_ISBN
4-89114-008-9
Type
conf
DOI
10.1109/IWIT.2000.928774
Filename
928774
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