Title :
A fully integrated high power RF MEMS switch in package
Author :
Sung Jun Kim ; Yang Zhang ; Minfeng Wang ; Bachman, Mark ; Li, G.P.
Author_Institution :
Univ. of California, Irvine, Irvine, CA, USA
Abstract :
We report a high power laminate switch for radio frequency (RF) applications. This switch can be embedded within RF circuits or serve as a standalone component. For various RF applications, we demonstrated how switch, RF and mechanical performances are correlated to each other by varying the design parameters. Low contact resistance, 0.3 Ω and decent RF performance, -0.35 dB insertion loss and -18 dB isolation at 9 GHz were achieved.
Keywords :
contact resistance; microswitches; semiconductor device packaging; RF applications; RF circuits; contact resistance; design parameters; frequency 9 GHz; fully integrated high power RF MEMS switch; high power laminate switch; insertion loss; mechanical performances; radio frequency applications; resistance 0.3 ohm; Contact resistance; Force; Microswitches; Radio frequency; Substrates; Temperature measurement;
Conference_Titel :
Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
Conference_Location :
San Diego, CA
DOI :
10.1109/ECTC.2015.7159706
