Full SiC half-bridge module for high frequency and high temperature operation

An innovative power electronics half-bridge module concept exploiting 3D-design features was proposed to achieve low stray inductance and balanced current sharing, and thus module fast switching capability. In order to verify the switching performance of the concept, a 1.2 kV / 100 A full SiC module was designed using electromagnetic simulations and fabricated exploiting state-of-the-art but still conventional packaging technologies. Afterwards the module was tested and benchmarked to commercially available SiC modules. Performed tests confirmed fast switching capability of the proposed concept and showed more than 20 % lower switching losses compared to the benchmarked commercial modules.