DocumentCode :
3177102
Title :
Inkjet printed single layer high-density circuitry for a MEMS device
Author :
Laurila, Mika-Matti ; Soltani, Ayat ; Mantysalo, Matti
Author_Institution :
Tampere Univ. of Technol., Tampere, Finland
fYear :
2015
fDate :
26-29 May 2015
Firstpage :
968
Lastpage :
972
Abstract :
For example high-density redistribution layers (RDL) require narrow conductor width and low enough resistance. We have studied the applicability of an additive electrodynamic inkjet printer, Super Inkjet (SIJ), as a potential replacement for the current non-additive manufacturing method used in circuitry fabrication for MEMS devices. This was done by examining the topography of the printed lines and relating this to the resistance. For example five and two micron wide conductors were demonstrated with aspect ratio as high as 0,8 and 0,9. The average resistivity value for the five micron wide conductors was 17 μOhm·cm and 15 μOhm·cm for the two micron case. Also the repeatability of the line width calibration process was evaluated. The accuracy was found to be approximately one micron.
Keywords :
ink jet printing; micromechanical devices; MEMS device; additive electrodynamic inkjet printer; circuitry fabrication; conductor width; high-density redistribution layers; inkjet printed single layer high-density circuitry; line width calibration process; nonadditive manufacturing method; printed lines; super inkjet; wide conductors; Calibration; Conductivity; Conductors; Electrical resistance measurement; Ink; Printing; Resistance;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
Conference_Location :
San Diego, CA
Type :
conf
DOI :
10.1109/ECTC.2015.7159712
Filename :
7159712
Link To Document :
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