DocumentCode :
3178035
Title :
Effect of Thermal strain in helical slow-wave circuit on TWT Cold-test characteristics
Author :
Yao, Lieming ; Yang, Zhonghai ; Huo, Zhongsheng ; Zhu, Xiaofang ; Li, Bin
Author_Institution :
Univ. of Electron. Sci. & Technol. of China, Chengdu
fYear :
2007
fDate :
15-17 May 2007
Firstpage :
1
Lastpage :
2
Abstract :
The heat transfer analysis presented in this study deals with the thermal performance of the helix slow-wave circuit for TWT. The current paper estimate the temperature of helix accurately through finite element software ANSYS. The expansion of rods makes the helix concave or convex at different position. Thermal strain made the radius of the tape increased overall, so the phase velocity decreases as the temperature of helix gets higher. But the impedance keeps almost the same value as the temperature increasing. Based on this kind of information, manufacturers can adjust and optimize the designs of devices before fabrication.
Keywords :
finite element analysis; heat transfer; slow wave structures; TWT cold-test characteristics; finite element software ANSYS; heat transfer analysis; helical slow-wave circuit; phase velocity; thermal strain effect; Capacitive sensors; Circuits; Design optimization; Fabrication; Finite element methods; Heat transfer; Impedance; Manufacturing; Performance analysis; Temperature;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Vacuum Electronics Conference, 2007. IVEC '07. IEEE International
Conference_Location :
Kitakyushu
Print_ISBN :
1-4244-0633-1
Type :
conf
DOI :
10.1109/IVELEC.2007.4283237
Filename :
4283237
Link To Document :
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