• DocumentCode
    3178302
  • Title

    Advanced Microfabrication Techniques for Millimetre Band Cavities

  • Author

    Verdiel, Marc ; Protz, Jon

  • Author_Institution
    Duke Univ. Durham, Durham
  • fYear
    2007
  • fDate
    15-17 May 2007
  • Firstpage
    1
  • Lastpage
    2
  • Abstract
    microfabrication recipe involving Deep Reactive Ion Etching, Chemical Mechanical Polishing, and Silicon Direct Bonding is proposed as a way to fabricate high precision cavities for millimetre band devices. The effect of fabrication variances on device performance is predicted.
  • Keywords
    integrated circuit bonding; millimetre wave devices; polishing; sputter etching; advanced microfabrication techniques; chemical mechanical polishing; deep reactive ion etching; millimetre band cavities; silicon direct bonding; Chemicals; Etching; Fabrication; Frequency; Intelligent sensors; Passivation; Rough surfaces; Shape control; Silicon; Surface roughness;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Vacuum Electronics Conference, 2007. IVEC '07. IEEE International
  • Conference_Location
    Kitakyushu
  • Print_ISBN
    1-4244-0633-1
  • Type

    conf

  • DOI
    10.1109/IVELEC.2007.4283251
  • Filename
    4283251
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=3178302