Title :
A semiconductor strain gage tactile transducer
Author :
Obana, Fernando Y. ; Carvalho, Aparecido A. ; Gualda, Renato ; Silva, Josivaldo G da
Author_Institution :
Dept. of Electr. Eng., State Univ. of Sao Paulo, Brazil
Abstract :
This paper describes the development of a semiconductor strain gage tactile transducer. It was designed with the goal of measuring finger forces without affecting the hand dexterity. The transducer structure was manufactured with stainless steel and has small dimensions (4 mm diameter and 1 mm thickness). It is light and suitable to connect to the finger pads. It has a device that prevents its damage when overforces are applied. The semiconductor strain gage was used due its small size and high sensitivity, although it has high temperature sensitivity. Theory, design and construction details are presented. The signal conditioning circuit is very simple because the semiconductor strain gage sensitivity is high. It presents linear response from 0 to 100 N, 0.5 N resolution, fall time of 7.2 ms, good repeatability, and small hysteresis. The semiconductor strain gage transducer has characteristics that can make it very useful in rehabilitation engineering, robotics, and medicine
Keywords :
biocontrol; biomedical transducers; bridge circuits; dexterous manipulators; electric sensing devices; force sensors; neuromuscular stimulation; patient rehabilitation; piezoresistive devices; strain gauges; tactile sensors; 1 mm; 4 mm; FES; Wheatstone bridge; finger forces; finger pad connection; force sensor; high sensitivity; linear response; rehabilitation engineering; repeatability; robotics; semiconductor strain gage; signal conditioning circuit; small dimensions; small hysteresis; stainless steel; tactile transducer; Capacitive sensors; Circuits; Fingers; Force measurement; Hysteresis; Semiconductor device manufacture; Signal resolution; Steel; Temperature sensors; Transducers;
Conference_Titel :
Instrumentation and Measurement Technology Conference, 2001. IMTC 2001. Proceedings of the 18th IEEE
Conference_Location :
Budapest
Print_ISBN :
0-7803-6646-8
DOI :
10.1109/IMTC.2001.928854