• DocumentCode
    3179045
  • Title

    Redundant via insertion under timing constraints

  • Author

    Pan, Chi-Wen ; Lee, Yu-Min

  • Author_Institution
    Nat. Chiao Tung Univ., Hsinchu, Taiwan
  • fYear
    2011
  • fDate
    14-16 March 2011
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    Redundant via insertion is a useful technique to alleviate the yield loss and elevate the reliability of VLSI designs. While extra vias are inserted into the design, the electronic properties of designed circuit might be altered, and the circuit timing might be changed and needs to be efficiently re-analyzed. Therefore, a fast timing (incremental timing) analyzer is required to assistant the redundant via insertion procedure. This work develops an efficient redundant via insertion method under timing constraints. Firstly, an effectively incremental circuit timing analysis method is developed, and the redundant via insertion task is transformed into a mixed bipartite-conflict graph matching problem. Then, the insertion problem is solved by a timing-driven minimum weighted matching algorithm. The experimental results show that the developed algorithm can achieve 3.2% extra insertion rates over the method without considering timing effects, which all redundant vias would be removed if the timing of that net does not meet the timing requirements, in average. In addition, the developed incremental timing analysis mechanism can speed up the runtime of redundant via insertion procedure under timing constraints by over 34 times in average.
  • Keywords
    VLSI; integrated circuit design; integrated circuit reliability; integrated circuit yield; redundancy; VLSI design reliability; designed circuit; electronic property; extra insertion rates; fast timing; incremental circuit timing analysis method; incremental timing analysis mechanism; incremental timing analyzer; mixed bipartite-conflict graph matching problem; redundant via insertion; timing constraints; timing effects; timing-driven minimum weighted matching algorithm; yield loss; Algorithm design and analysis; Capacitance; Delay; Resistance; Routing; Wire;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Quality Electronic Design (ISQED), 2011 12th International Symposium on
  • Conference_Location
    Santa Clara, CA
  • ISSN
    1948-3287
  • Print_ISBN
    978-1-61284-913-3
  • Type

    conf

  • DOI
    10.1109/ISQED.2011.5770794
  • Filename
    5770794