Steady state thermal characterization and junction temperature estimation of multi-chip module packages using the response surface method

The steady state thermal performance of semiconductor packages has been traditionally reported through the use of a single junction-to-ambient thermal resistance constant commonly referred to as θ_ja. This is particularly inadequate for multi-chip modules, where several devices reside within the same package structure. This paper discusses how a central composite design of experiments can be applied to provide a more accurate thermal characterization of a multi-chip module package. The end product is a series of linear or polynomial equations which can be utilized by the customer to calculate individual device junction temperatures over a wide variation of convection cooling environments and multiple device power dissipations. A 352 plastic ball grid array package, which encompasses three individual devices, is used as an example. The paper steps through the sensitivity analysis and evaluates the accuracy of the resulting equations. This method of thermal characterization can be easily applied to single chip modules of varying power and cooling regimes, or multiple output devices where several power junctions reside within the same integrated circuit