Title :
Thermal and hydraulic behavior of plate fin and strip fin heat sinks under varying bypass conditions
Author :
Jonsson, Hans ; Palm, Björn
Author_Institution :
R. Inst. of Technol., Stockholm, Sweden
Abstract :
Tests have been conducted in a wind tunnel with nine heat sinks of three different types, including plate fin heat sinks and strip fin heat sinks arranged in both in-line and staggered arrays. For each type, tests were run with fin heights (H) of 10, 20 and 30 mm while the heat sink width (B) was kept constant and equal to 52.8 mm. The wind tunnel duct width (CB) was varied in such a way that results were obtained for B/CB=0.84, 0.67, and 0.33. The wind tunnel height (CH) was varied similarly, and data were recorded for H/CH=1, 0.67, and 0.33 while the duct Reynolds number was varied between 2000 through 14000. An empirical bypass correlation has been fitted to the experimental data. Generally, the agreement between experimental data and correlation is within ±10% for the thermal resistance, and within ±20% for the pressure drop. From the experimental data, the fraction of the total airflow passing through each heat sink has been estimated and is compared to a simple physical bypass model
Keywords :
cooling; heat sinks; packaging; thermal analysis; thermal management (packaging); thermal resistance; wind tunnels; 10 mm; 20 mm; 30 mm; 52.8 mm; airflow fraction; bypass conditions; duct Reynolds number; empirical bypass correlation fitting; fin height; heat sink width; heat sinks; hydraulic behavior; in-line heat sink array; physical bypass model; plate fin heat sinks; pressure drop; staggered heat sink array; strip fin heat sinks; thermal behavior; thermal resistance; wind tunnel duct width; wind tunnel height; wind tunnel tests; Ducts; Electronic components; Electronics cooling; Heat sinks; Heat transfer; Refrigeration; Strips; Testing; Thermal resistance; Thermodynamics;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4475-8
DOI :
10.1109/ITHERM.1998.689525