DocumentCode :
3179217
Title :
Natural convection air cooling characteristics of plate fins in a ventilated electronic cabinet
Author :
Iwasaki, Hideo ; Ishizuka, Masaru
Author_Institution :
Res. & Dev. Center, Toshiba Corp., Kawasaki, Japan
fYear :
1998
fDate :
27-30 May 1998
Firstpage :
124
Lastpage :
129
Abstract :
This work aims to evaluate natural convection air cooling characteristics of compact vertical rectangular plate fin arrays in a ventilated electronic cabinet. The work focuses on plate fin arrays applicable to notebook personal computers and engineering workstations. 3D laminar flow analyses using the finite volume method were performed in order to evaluate the natural air cooling characteristics of vertical rectangular plate fin arrays located in a ventilated electronic cabinet with cooling air inlet and exit. The governing equations are the continuity, momentum, and energy equations with buoyancy term using Boussinesq approximation. The equations were solved using the SIMPLE scheme. Calculations were carried out for plate spacing S=3, 4, 5 mm, fin height H=20, 30, 40 mm, cooling air inlet and exit height B=2.5, 5, 10 mm, and fin length L=10 mm. Numerical results indicated that the average heat transfer coefficient of the fin increases with increase in both the plate spacing S and the cooling air inlet and exit height B, and that the average heat transfer coefficient of the fin base is about one order of magnitude less than that of the fin surface. Results also showed that in the case where the fin length is equal to the air inlet height, the average fin heat transfer coefficient is almost equal to that of natural convection in a vertical rectangular channel. Additionally, based on numerical results, some empirical equations for the average Nusselt number of vertical rectangular plate fin arrays located in a ventilated electronic cabinet with cooling air inlet and exit are proposed as a function of Ras
Keywords :
cooling; engineering workstations; finite volume methods; flow simulation; laminar flow; natural convection; notebook computers; thermal management (packaging); 10 mm; 2.5 mm; 20 mm; 3 mm; 30 mm; 3D laminar flow analyses; 4 mm; 40 mm; 5 mm; Boussinesq approximation; SIMPLE equation solution scheme; average Nusselt number; average fin heat transfer coefficient; average heat transfer coefficient; buoyancy term; continuity equations; cooling air exit; cooling air exit height; cooling air inlet; cooling air inlet height; energy equations; engineering workstations; fin base; fin height; fin length; fin surface; finite volume method; momentum equations; natural air cooling characteristics; natural convection; natural convection air cooling; natural convection air cooling characteristics; notebook personal computers; plate fin arrays; plate spacing; ventilated electronic cabinet; vertical rectangular channel; vertical rectangular plate fin arrays; Electronics cooling; Equations; Heat sinks; Heat transfer; Microcomputers; Temperature; Thermal conductivity; Thermal expansion; Tin; Workstations;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on
Conference_Location :
Seattle, WA
ISSN :
1089-9870
Print_ISBN :
0-7803-4475-8
Type :
conf
DOI :
10.1109/ITHERM.1998.689529
Filename :
689529
Link To Document :
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