Title :
Analyses of flip chip bumps and solder joints for six sigma manufacturing
Author :
Wolverton, Mike ; Chan, Yiu Wai Andy ; Baughn, Terry
Author_Institution :
Raytheon Electron., Dallas, TX, USA
Abstract :
The manufacture of six sigma quality high density interconnects by use of tin-lead solder flip chip bumps has prompted the application of computational analysis tools to assist in establishing the significance of variations of the bumps. Analytical model results and finite element predictions of solder joint geometry were compared to measured data. The solder geometric data and independently established component and substrate warpage were combined to calculate interconnect manufacturability
Keywords :
circuit analysis computing; finite element analysis; flip-chip devices; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; integrated circuit yield; microassembling; quality control; soldering; component warpage; computational analysis tools; finite element predictions; flip chip bumps; flip chip solder joints; high density interconnects; interconnect manufacturability; six sigma manufacturing; six sigma quality manufacture; solder bump variations; solder geometric data; solder joint geometry; substrate warpage; tin-lead solder flip chip bumps; Analytical models; Computer aided manufacturing; Computer applications; Finite element methods; Flip chip; Geometry; Independent component analysis; Semiconductor device measurement; Six sigma; Soldering;
Conference_Titel :
Thermal and Thermomechanical Phenomena in Electronic Systems, 1998. ITHERM '98. The Sixth Intersociety Conference on
Conference_Location :
Seattle, WA
Print_ISBN :
0-7803-4475-8
DOI :
10.1109/ITHERM.1998.689536
