DocumentCode
3179363
Title
Organic Multi-Chip Module for high performance systems
Author
Lei Shan ; Kwark, Young ; Baks, Christian ; Gaynes, Michael ; Chainer, Timothy ; Kapfhammer, Mark ; Saiki, Hajime ; Kuhara, Atsushi ; Aguiar, Gil ; Ban, Noritaka ; Nukaya, Yoshiki
Author_Institution
IBM T J Watson Res. Center, Yorktown Heights, NY, USA
fYear
2015
fDate
26-29 May 2015
Firstpage
1725
Lastpage
1729
Abstract
In this work, IBM Research and NTK Technologies have explored the development of an organic Multi-Chip Module (MCM) solution, with the goal of developing innovative technologies that address the requirements of high performance systems. A 90 × 90 mm organic MCM was designed, fabricated, and assembled with dual side mountable 24 × 28 mm thermal test chips mounted on chip-scale interposers to enable functional screening and rework process. The work demonstrated that a large scale organic MCM was compatible with LGA sockets with over 6000 contacts.
Keywords
chip scale packaging; multichip modules; organic semiconductors; LGA sockets; chip-scale interposers; dual side mountable thermal test chips; functional screening; high performance systems; organic multi-chip module; rework process; Assembly; Ceramics; Gold; Substrates; Thermal stresses; Transmission line measurements; Wiring;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
Conference_Location
San Diego, CA
Type
conf
DOI
10.1109/ECTC.2015.7159830
Filename
7159830
Link To Document