DocumentCode :
3179689
Title :
Software reliability analysis with optimal release problems based on hazard rate model for an embedded OSS
Author :
Tamura, Yoshinobu ; Yamada, Shigeru
Author_Institution :
Grad. Sch. of Sci. & Eng., Yamaguchi Univ., Ube, Japan
fYear :
2010
fDate :
10-13 Oct. 2010
Firstpage :
720
Lastpage :
726
Abstract :
An OSS (open source software) system is frequently applied as server use, instead of client use. Especially, embedded OSS systems have been gaining a lot of attention in the embedded system area, i.e., Android, BusyBox, TRON, etc. However, the poor handling of quality problem and customer support prohibit the progress of embedded OSS. Also, it is difficult for developers to assess the reliability and portability of embedded OSS on a single-board computer. We focus on software quality/reliability problems that can prohibit the progress of embedded OSS. In this paper, we propose a method of software reliability assessment based on a hazard rate model for the embedded OSS. In particular, we derive several assessment measures from the model. Also, we analyze actual software failure-occurrence time-interval data to show numerical examples of software reliability assessment for the embedded OSS. Moreover, we discuss the optimal software release problem for the porting-phase based on the total expected software maintenance cost.
Keywords :
embedded systems; public domain software; software fault tolerance; software maintenance; software portability; software quality; software reliability; embedded OSS system; hazard rate model; open source software system; optimal software release problem; single-board computer; software failure-occurrence time-interval data; software maintenance cost; software portability; software quality; software reliability assessment analysis; Computational modeling; Nickel; Reliability; Embedded system; Modeling; Open source software; Optimal release problem; Reliability;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Systems Man and Cybernetics (SMC), 2010 IEEE International Conference on
Conference_Location :
Istanbul
ISSN :
1062-922X
Print_ISBN :
978-1-4244-6586-6
Type :
conf
DOI :
10.1109/ICSMC.2010.5641839
Filename :
5641839
Link To Document :
بازگشت