DocumentCode
3180537
Title
Crosstalk challenge and mitigation through strategic pin placement for 25Gbps and beyond
Author
Shen Dong ; Nanju Na ; Hong Shi ; Ramalingam, Suresh
Author_Institution
Xilinx Inc., San Jose, CA, USA
fYear
2015
fDate
26-29 May 2015
Firstpage
2114
Lastpage
2119
Abstract
In high density, high speed Serdes interconnect designs, inappropriate pin placement can lead to differential crosstalk violation. How to relatively compare the crosstalk level due to various pin placements, and estimate its effect on the whole system without time consuming simulation is critical. This paper introduces a simple method to estimate the relative differential crosstalk due to various pin distributions. The effectiveness of this method is investigated using commercial 3D electromagnetic software. How the surrounding environment can affect the crosstalk level is also studied in this article.
Keywords
crosstalk; integrated circuit packaging; 3D electromagnetic software; crosstalk level; crosstalk violation; pin distributions; strategic pin placement; Couplings; Crosstalk; Dielectric constant; Estimation; Pins; Solid modeling; Three-dimensional displays;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
Conference_Location
San Diego, CA
Type
conf
DOI
10.1109/ECTC.2015.7159894
Filename
7159894
Link To Document