• DocumentCode
    3180537
  • Title

    Crosstalk challenge and mitigation through strategic pin placement for 25Gbps and beyond

  • Author

    Shen Dong ; Nanju Na ; Hong Shi ; Ramalingam, Suresh

  • Author_Institution
    Xilinx Inc., San Jose, CA, USA
  • fYear
    2015
  • fDate
    26-29 May 2015
  • Firstpage
    2114
  • Lastpage
    2119
  • Abstract
    In high density, high speed Serdes interconnect designs, inappropriate pin placement can lead to differential crosstalk violation. How to relatively compare the crosstalk level due to various pin placements, and estimate its effect on the whole system without time consuming simulation is critical. This paper introduces a simple method to estimate the relative differential crosstalk due to various pin distributions. The effectiveness of this method is investigated using commercial 3D electromagnetic software. How the surrounding environment can affect the crosstalk level is also studied in this article.
  • Keywords
    crosstalk; integrated circuit packaging; 3D electromagnetic software; crosstalk level; crosstalk violation; pin distributions; strategic pin placement; Couplings; Crosstalk; Dielectric constant; Estimation; Pins; Solid modeling; Three-dimensional displays;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
  • Conference_Location
    San Diego, CA
  • Type

    conf

  • DOI
    10.1109/ECTC.2015.7159894
  • Filename
    7159894