DocumentCode :
3180537
Title :
Crosstalk challenge and mitigation through strategic pin placement for 25Gbps and beyond
Author :
Shen Dong ; Nanju Na ; Hong Shi ; Ramalingam, Suresh
Author_Institution :
Xilinx Inc., San Jose, CA, USA
fYear :
2015
fDate :
26-29 May 2015
Firstpage :
2114
Lastpage :
2119
Abstract :
In high density, high speed Serdes interconnect designs, inappropriate pin placement can lead to differential crosstalk violation. How to relatively compare the crosstalk level due to various pin placements, and estimate its effect on the whole system without time consuming simulation is critical. This paper introduces a simple method to estimate the relative differential crosstalk due to various pin distributions. The effectiveness of this method is investigated using commercial 3D electromagnetic software. How the surrounding environment can affect the crosstalk level is also studied in this article.
Keywords :
crosstalk; integrated circuit packaging; 3D electromagnetic software; crosstalk level; crosstalk violation; pin distributions; strategic pin placement; Couplings; Crosstalk; Dielectric constant; Estimation; Pins; Solid modeling; Three-dimensional displays;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Electronic Components and Technology Conference (ECTC) , 2015 IEEE 65th
Conference_Location :
San Diego, CA
Type :
conf
DOI :
10.1109/ECTC.2015.7159894
Filename :
7159894
Link To Document :
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