Characterization of electrical properties of glass and transmission lines on thin glass up to 50 GHz

This paper presents, for the first time, the characterization of electrical properties of Glass/ZIF stack-up and transmission lines on glass/ZIF up to 50 GHz. Ring resonators, co-planar wave guide (CPW), CPWs with Thru-Package-Vias (TPVs) and microstrip to CPW transitions are designed, fabricated and measured on a 300/33 μm glass/ZIF substrate. The Short-Open-Load-Through (SOLT) calibration technique was used to measure the fabricated structures. Measurements show promising RF performance of glass and T.L on glass up to 50 GHz. An insertion loss of 0.05 dB/mm at 20 GHz and 0.12 dB/mm at 50 GHz for a CPW line has been measured. The microstrip to CPW transition exhibited 0.24 dB/mm of loss and a thru-package-via exhibited a loss of 0.34 dB at 50 GHz. A dielectric constant of 4.95 and loss tangent of 0.012 at 50 GHz is also reported.