DocumentCode
3181445
Title
Assembly inside a Scanning Electron Microscope using Electron Beam induced Deposition
Author
Wich, T. ; Sievers, T. ; Fatikow, S.
Author_Institution
Div. Microrobotics & Control Eng., Oldenburg Univ.
fYear
2006
fDate
Oct. 2006
Firstpage
294
Lastpage
299
Abstract
In this paper a new assembly process inside a scanning electron microscope (SEM) is demonstrated. The process includes the separation and handling of a silicon nanowire and its bonding to an atomic force microscope (AFM) probe using electron beam induced deposition (EBiD). EBiD is carried out by using the electron beam of the SEM and a flexible mobile microrobot as transporter of the precursor gas. In addition, experiments are presented to investigate mechanical and chemical properties of the bonded nanowire. Real-time object tracking and image processing are used to measure the force applied to the Si-nanowire. In this way, the load and tension stress on the bonds can be calculated. Finally, energy dispersive X-ray (EDX) analysis is applied to the bonds to estimate their chemical composition
Keywords
assembling; atomic force microscopy; electron beam deposition; elemental semiconductors; microrobots; mobile robots; nanotechnology; nanowires; scanning electron microscopes; silicon; assembly; atomic force microscope probe; electron beam induced deposition; flexible mobile microrobot; image processing; load stress; precursor gas; real-time object tracking; scanning electron microscope; silicon nanowire; tension stress; Assembly; Atomic beams; Atomic force microscopy; Atomic layer deposition; Bonding forces; Chemical analysis; Electron beams; Force measurement; Scanning electron microscopy; Silicon; EBiD; image processing; microassembly; microrobots;
fLanguage
English
Publisher
ieee
Conference_Titel
Intelligent Robots and Systems, 2006 IEEE/RSJ International Conference on
Conference_Location
Beijing
Print_ISBN
1-4244-0259-X
Electronic_ISBN
1-4244-0259-X
Type
conf
DOI
10.1109/IROS.2006.282237
Filename
4058855
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