The Microelectronic Devices Failure Diagnostics

Issues regarding microelectronic devices diagnostics are discussed in this paper. Constant high temperature exposure period and fast temperature cycling are two main methods of thermal load, used for computer electronics components. Efficiency estimation of every cycle´s influence on the process of faster defect detection with defined parameter is considered in this paper. Let use activation system by Arrenius-Iring, which shows efficiency of thermal action on the acceleration of degradation processes. Taking into account this analysis, proposed equations could be compared in point of their efficiency and relation acceleration of the defect detection in electronic devices.