• DocumentCode
    3181703
  • Title

    A new method to estimate sound energy entering the middle ear

  • Author

    Shixiong Chen ; Jun Deng ; Lin Bian ; Guanglin Li

  • Author_Institution
    Inst. of Biomed. & Health Eng., Shenzhen Inst. of Adv. Technol., Shenzhen, China
  • fYear
    2013
  • fDate
    3-7 July 2013
  • Firstpage
    29
  • Lastpage
    32
  • Abstract
    Standing waves in the ear canal can cause inaccurate quantification of the sound pressure level (SPL) entering the ear and therefore lead to unreliable results in clinical tests. Since it is impractical to directly measure the SPL at the eardrum position, in this study we proposed a new method to estimate the eardrum SPL by solely making measurement at the entry of the ear canal. To achieve this, the acoustic characteristics of the earphone were calculated using a calculation tube with variable lengths. Then the ear canal impedance was calculated according to the obtained source characteristics. Finally, the eardrum SPL was estimated by the ear-canal impedance and the SPL measured at the entry of the ear canal. The results showed that the eardrum SPL could be reliably estimated for all the five subjects participated in this study. The maximal estimation error was less than 3 dB for all frequencies from 0.5 to 10 kHz. These findings suggested that the proposed method could avoid the standing wave problem and therefore might be a great candidate for accurate calibration of sound pressure in various acoustic measurements.
  • Keywords
    acoustic impedance; acoustic intensity measurement; acoustic waves; biomedical measurement; ear; ear canal impedance; eardrum SPL; earphone; frequency 0.5 kHz to 10 kHz; maximal estimation error; middle ear; sound energy estimation; sound pressure level; Acoustic measurements; Acoustics; Ear; Electron tubes; Impedance; Irrigation; Transmission line measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
  • Conference_Location
    Osaka
  • ISSN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2013.6609429
  • Filename
    6609429