Title :
Ink-jet Printing of Nano Materials and Processes for Electronics Applications
Author :
Suganuma, K. ; Wakuda, D. ; Hatamura, M. ; Kim, K.S.
Author_Institution :
Inst. of Sci. & Ind. Res., Osaka Univ., Osaka
Abstract :
Ag metallic particles from nano-scale to submicron-scale are combined with organic solvent to provide fine circuits and interconnection. Ag nanoparticle pastes have been successfully adopted to ink-jet wiring and the multilayered circuit layers in a SiP structure. Ink-jet printing with Ag nano particle pastes demonstrated the potentials of the new printed electronics technology. Lowering process temperature for Ag nanoparticle pastes finally reached room temperature wiring in air atmosphere.
Keywords :
integrated circuit interconnections; nanoelectronics; nanoparticles; organic compounds; printed circuits; printing; silver; solvent effects; system-in-package; Ag; SiP structure; electronics applications; ink-jet printing; interconnection; multilayered circuit layers; nanoparticle pastes; nanoprocesses; organic solvent; printed electronics technology; room temperature wiring; silver metallic nanoparticles; temperature 293 K to 298 K; Circuits; Conducting materials; Ink jet printing; Inorganic materials; Nanoparticles; Organic materials; Solvents; Stacking; Temperature; Wiring; Ag nano particles; ink-jet printing; metallic ink; room temperature wiring;
Conference_Titel :
High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-1252-8
Electronic_ISBN :
1-4244-1253-6
DOI :
10.1109/HDP.2007.4283547
