DocumentCode :
3181768
Title :
Interconnection Technologies of Anisotropic Conductive Films and Their Application to Flexible Electronics
Author :
Matsuda, Kazuya ; Watanabe, Itsuo
Author_Institution :
Electron. Mater. Bus. Sector, Hitachi Chem. Co., Ltd., Chikusei
fYear :
2007
fDate :
26-28 June 2007
Firstpage :
1
Lastpage :
4
Abstract :
Anisotropic conductive films (ACFs) consist of conducting particles and adhesive resins and have been widely used for packaging technologies in FPDs (Flat Panel Displays) such as LCDs (Liquid Crystal Displays) for last decades. So far various packaging technologies such as TCP (Tape Carrier Package) on LCD panel or PWB (Printed Wiring Board), COF (Chip on flex) on LCD panel or PWB and COG (Chip on Glass) using ACFs have been developed to meet the requirement of fine pitch capability and make the flat panel displays smaller, lighter and thinner. Also ACFs are flip-chip technologies have been of much interest because they provide higher packaging density than conventional semiconductor packaging technologies such as face-up wire bonding. In addition, ACFs are expected as interconnect materials which realize flexible electronics such as flexible display and RFID (Radio Frequency Identification).
Keywords :
anisotropic media; chip scale packaging; conductive adhesives; fine-pitch technology; flexible electronics; flip-chip devices; integrated circuit interconnections; resins; FPD; LCD; PWB; RFID; TCP; adhesive resin; anisotropic conductive film; chip-on-flex; chip-on-glass; conducting particles; fine pitch capability; flat panel displays; flexible electronics; flip-chip technology; interconnection technology; liquid crystal displays; packaging technology; printed wiring board; radio frequency identification; tape carrier package; Anisotropic conductive films; Electronics packaging; Flat panel displays; Flexible electronics; Glass; Liquid crystal displays; Radiofrequency identification; Resins; Semiconductor device packaging; Wiring;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-1252-8
Electronic_ISBN :
1-4244-1253-6
Type :
conf
DOI :
10.1109/HDP.2007.4283550
Filename :
4283550
Link To Document :
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