Title :
Tin Whiskers: How to Mitigate and Manage the Risks
Author :
Mathew, Sony ; Osterman, Michael ; Shibutani, Tadahiro ; Yu, Qiang ; Pecht, Michael
Author_Institution :
Center for Adv. Life Cycle Eng., Univ. of Maryland, College Park, MD
Abstract :
The selection of lead-free tin based surface finishes resulting from government regulation of lead has reintroduced, into the spotlight, the reliability concern due to the possible formation of electrically conductive tin whiskers. This paper reviews risk mitigation studies including use of tin alloys, conformal coating, electroplating techniques, surface treatment, annealing, and use of under-layer material. This paper also discusses approaches to manage the risk due to tin whiskers.
Keywords :
annealing; conformal coatings; electrical conductivity; electronics industry; electroplating; reliability; risk management; surface finishing; tin; tin alloys; whiskers (crystal); Sn; annealing; conformal coating; electrically conductive tin whiskers formation; electronics industry; electroplating techniques; government regulation; lead-free tin whiskers; reliability concerns; risk mitigation studies; risks management; surface finishing; surface treatment; tin alloys; under-layer material; Annealing; Coatings; Conducting materials; Conductors; Environmentally friendly manufacturing techniques; Lead; Risk management; Surface finishing; Surface treatment; Tin alloys;
Conference_Titel :
High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-1252-8
Electronic_ISBN :
1-4244-1253-6
DOI :
10.1109/HDP.2007.4283551
