Title :
Densification in Electronics Packaging and Assembly
Author_Institution :
Intel Corp., Santa Clara, CA
Abstract :
Summary form only given. Demand for smaller, faster, and low cost electronics has led the electronics industry move to very fine interconnects on both Ball Grid Array (BGA) surface mount assembly, flip chip packaging level. The trend of densification challenges board assembly material, processes and reliability. HDI PCB materials will become mainstream for electronics to address the increasing I/O density. The electrical, mechanical, thermal and chemical interaction impacts to solder joint reliability needs to be addressed. Low stress flip chip assembly technology will be needed for next generation flip chip technology.
Keywords :
ball grid arrays; chip scale packaging; densification; electronics industry; flip-chip devices; integrated circuit interconnections; integrated circuit reliability; solders; surface mount technology; thermal management (packaging); BGA surface mount assembly; ball grid arrays; chemical interaction; densification; electrical interaction; electronics -assembly; electronics packaging; flip chip packaging level; flip chip technology; low stress flip chip assembly technology; mechanical interaction; solder joint reliability; thermal interaction; Assembly; Chemical technology; Costs; Electronic packaging thermal management; Electronics industry; Electronics packaging; Flip chip; Industrial electronics; Materials reliability; Soldering;
Conference_Titel :
High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-1252-8
Electronic_ISBN :
1-4244-1253-6
DOI :
10.1109/HDP.2007.4283553
