Title :
Reliability Analysis of SiP Structures
Author :
Bailey, Chris ; Stoyanov, Stoyan ; Strusevich, Nadia ; Yannou, Jean-Marc
Author_Institution :
Sch. of Comput. & Math. Sci., Greenwich Univ., London
Abstract :
This presentation discusses latest developments in SiP technology and the challenges for design in terms of manufacture and reliability. It presents results from a UK government funded project that aims to develop modelling techniques that will assess the thermo-mechanical reliability of SiP structures such as (i) stacked die, (ii) side-by-side dies and (iii) embedded die. Finite element analysis coupled with numerical optimisation and uncertainty analysis is used is used to model the reliability of a particular package design. In particular, the damage (energy density) in the lead free solder interconnects under accelerated temperature cycling is predicted and used to observe the fatigue life-time. Warpage of the structure is also investigated.
Keywords :
design for manufacture; design for quality; fatigue testing; finite element analysis; integrated circuit design; integrated circuit interconnections; integrated circuit reliability; integrated circuit testing; life testing; solders; system-in-package; SiP technology; accelerated temperature cycling; design for manufacture; design for reliability; embedded die; fatigue life-time; finite element analysis; lead free solder interconnects; numerical optimisation; package design; reliability analysis; side-by-side dies; stacked die; thermo-mechanical reliability; uncertainty analysis; Acceleration; Coupled mode analysis; Design optimization; Environmentally friendly manufacturing techniques; Finite element methods; Government; Lead; Packaging; Thermomechanical processes; Uncertainty;
Conference_Titel :
High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-1252-8
Electronic_ISBN :
1-4244-1253-6
DOI :
10.1109/HDP.2007.4283556
