• DocumentCode
    3181913
  • Title

    Assembly Subcontractor Quality Management in Foundry

  • Author

    Wu, Bonner ; Chien, Kary ; Niou, Chorng ; Cao, Victor ; Xia, Eva

  • Author_Institution
    Semiconductor Manuf. Int. Co., Ltd., Shanghai
  • fYear
    2007
  • fDate
    26-28 June 2007
  • Firstpage
    1
  • Lastpage
    10
  • Abstract
    Semiconductor manufacturing process is becoming more and more complex while manufacturing technology is developed to deep sub-micron region. Therefore, more and more company is turning to capital-light and focusing on core business. Foundry is the player usually providing silicon manufacturing service to customers. According to customer´s capital-light strategy, foundries are required to provide more and more services out of silicon manufacturing, such as design service, silicon validation, assembly, and testing service. This is known as turnkey service. Foundries usually do not have their own assembly capacity. To ensure packaged product quality, a robust assembly subcontractor quality management system is very important for foundry. This paper will discuss on how to build up quality management system of subcontractor development, monitoring, and driving to continuous improvement.
  • Keywords
    assembling; continuous improvement; customer services; elemental semiconductors; foundries; semiconductor device manufacture; silicon; assembly subcontractor; capital-light strategy; continuous improvement; foundry; manufacturing customers service; manufacturing technology; packaged product quality; quality management; semiconductor manufacturing process; silicon manufacturing; subcontractor monitoring; turnkey service; Assembly; Companies; Foundries; Manufacturing processes; Quality management; Semiconductor device manufacture; Silicon; Subcontracting; Testing; Turning;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-1253-6
  • Electronic_ISBN
    1-4244-1253-6
  • Type

    conf

  • DOI
    10.1109/HDP.2007.4283559
  • Filename
    4283559