DocumentCode
3182100
Title
FBGA Die Crack Issue Analysis
Author
Jiang, Yuqi ; Song, Xianzhong ; Lam, Tim Fai ; Samatitchon, Surasez
Author_Institution
Spansion (China) Ltd., Suzhou
fYear
2007
fDate
26-28 June 2007
Firstpage
1
Lastpage
4
Abstract
Die crack issue was found for the electrical failure packages. Failure analysis was performed to characterize the crack line pattern and crack origin. Pick-place and testing operations were examined through FEA modeling. By studying the first principle stress distribution and its vector plot, the critical and possible situations were found.
Keywords
ball grid arrays; cracks; dyes; finite element analysis; FBGA die crack issue analysis; FEA modeling; electrical failure packages; stress distribution; Acoustic testing; Failure analysis; Inspection; Lead; Material properties; Packaging; Silicon; Sockets; Tensile stress; Thermal force;
fLanguage
English
Publisher
ieee
Conference_Titel
High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on
Conference_Location
Shanghai
Print_ISBN
1-4244-1253-6
Electronic_ISBN
1-4244-1253-6
Type
conf
DOI
10.1109/HDP.2007.4283571
Filename
4283571
Link To Document