Study of Aluminum Pad Contamination Sources during Wafer Fabrication, Shipping, Storage and Assembly

Author

Yu, Paul ; Su, Jamie ; Gao, Qiang ; Li, Ming ; Niou, Chorng

Author_Institution

Semicond. Manuf. Int. (Shanghai) Corp., Shanghai

fYear

2007

fDate

26-28 June 2007

Firstpage

1

Lastpage

3

Abstract

In this paper, pad contamination sources were summarized and several cases were studied. The fluorine on bond pad was introduced through top metal etch/pad opening process per etch gases or shipping related issue. The higher carbon and oxygen on the abnormal pad were introduced during the process of backside grinding in case.1. The package paper during shipping caused the oxygen and kalium contamination on the abnormal pad in case 2. In case 3, the silicon dust on the abnormal pad formed during die sawing.

Keywords

aluminium; etching; microassembling; surface contamination; wafer bonding; wafer level packaging; Al; aluminum pad contamination sources; backside grinding process; bond pad; die sawing; kalium contamination; pad opening process; silicon dust; top metal etch process; wafer assembly; wafer fabrication; wafer shipping; wafer storage; Aluminum; Assembly; Contamination; Etching; Fabrication; Gases; Packaging; Sawing; Silicon; Wafer bonding;

fLanguage

English

Publisher

ieee

Conference_Titel

High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on

Conference_Location

Shanghai

Print_ISBN

1-4244-1253-6

Electronic_ISBN

1-4244-1253-6

Type

conf

DOI

10.1109/HDP.2007.4283573

Filename

4283573