• DocumentCode
    3182203
  • Title

    Feasibility of rapid thermal MOCVD growth for fabrication of InP-based heterostructures

  • Author

    Kreinin, O. ; Bahir, G.

  • Author_Institution
    Dept. of Electr. Eng., Technion-Israel Inst. of Technol., Haifa, Israel
  • fYear
    2001
  • fDate
    2001
  • Firstpage
    401
  • Lastpage
    404
  • Abstract
    Semiconductor lasers require the growth of an “active” multi-layer heterostructure, a subsequent definition of the lateral waveguide feature and re-growth of a burying semi-insulating layer. Here we demonstrate a feasibility of Rapid Thermal Metal Organic Chemical Vapor Deposition (RT-MOCVD) approach as a way to carry out of the various processes associated with the integrated manufacturing of InP-based laser devices: in situ cleaning and preservation of the InP substrates; III-V semiconductor layer deposition; Growth of the quantum well structures; Selective growth of InP and InGaAs using an ion implanted mask-less definition for the selective epitaxy; in situ Rapid Thermal Annealing of the ion implanted damaged area; Re-growth of InP:Fe semi-insulating burying layer on the primary “masked surface”
  • Keywords
    III-V semiconductors; MOCVD; buried layers; indium compounds; quantum well lasers; rapid thermal annealing; semiconductor growth; semiconductor heterojunctions; InP; InP heterostructure; active multilayer heterostructure; buried semi-insulating layer; fabrication; lateral waveguide; quantum well structure; rapid thermal MOCVD growth; rapid thermal annealing; selective epitaxy; semiconductor laser; Chemical lasers; Chemical vapor deposition; Indium phosphide; MOCVD; Optical device fabrication; Organic chemicals; Rapid thermal processing; Semiconductor lasers; Semiconductor waveguides; Waveguide lasers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Indium Phosphide and Related Materials, 2001. IPRM. IEEE International Conference On
  • Conference_Location
    Nara
  • ISSN
    1092-8669
  • Print_ISBN
    0-7803-6700-6
  • Type

    conf

  • DOI
    10.1109/ICIPRM.2001.929143
  • Filename
    929143