DocumentCode
3182254
Title
Advances in Europe - China Green Electronics Collaboration
Author
Andersen, Otto ; Anderssen, Idun Husabo ; Liu, Johan ; Whalley, David ; Kristiansen, Helge ; Gronlund, Tom Ove ; Bukat, Krystyna ; Lu, Xiuzhen
Author_Institution
Western Norway Res. Inst, Sogndal
fYear
2007
fDate
26-28 June 2007
Firstpage
1
Lastpage
4
Abstract
A newly initiated effort in research on green electronics has resulted in recent advances in the collaboration between China and Europe. The effort was initiated with the research project EC-GEPRO (Europe-China cooperation in green electronics production research). This is funded by the European Commission and engages actors and stimulates high-level debates and cooperation on the development of Green Electronics. This is done through co-organising as well as evaluating the 2nd International Eco-electronics conferences December 7-8, 2006 in Beijing. An evaluation of this conference was carried out by the project, and important issues for improving future collaborative efforts of similar type were identified. In addition to expressing concerns about language and culture gaps, survey respondents placed particular emphasis on the lack of international networks and contacts as a barrier to further international collaboration, whilst suggesting possible ways of overcoming the various obstacles. In addition, the project has co-organised the IEEE CPMT symposium on green electronics in Gothenburg on May 23-24 2007.
Keywords
ecology; electronics industry; international collaboration; sustainable development; EC-GEPRO project; Europe-China green electronics collaboration; international collaboration; Collaboration; Electronic waste; Electronics packaging; Environmental factors; Europe; Lead; Legislation; Manufacturing processes; Product design; Production;
fLanguage
English
Publisher
ieee
Conference_Titel
High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on
Conference_Location
Shanghai
Print_ISBN
1-4244-1253-6
Electronic_ISBN
1-4244-1253-6
Type
conf
DOI
10.1109/HDP.2007.4283577
Filename
4283577
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