Temperature Dependence of Electrical Resistivity of Isotropic Conductive Adhesive Composed of An Epoxy-based Binder

The temperature dependence of electrical resistivity for a practical isotropic conductive adhesive (ICA) composed of an epoxy-based binder was investigated. The ICA specimens were cured and post-annealed at various conditions in order to clarify the effect of curing state of adhesive binder on the electrical resistivity. The electrical resistivity at ambient temperature tends to decrease with increasing curing temperature even if they exhibit full conversion. The annealing effect that results in deviation from linearity in the temperature dependence of resistivity can be induced during heating process for resistivity measurement. These specimens exhibited similar values for temperature coefficient of resistivity (TCR) regardless of curing and post-annealing conditions. However, the thermal history of the specimens significantly influences the values of electrical resistivity.