• DocumentCode
    3182338
  • Title

    Superhydrophobic Silica Thin Films Prepare by Sol-Gel Process for Antistiction of MEMS Devices

  • Author

    Xiu, Yonghao ; Zhu, Lingbo ; Hess, Dennis W. ; Wong, C.P.

  • Author_Institution
    Georgia Inst. of Technol., Atlanta
  • fYear
    2007
  • fDate
    26-28 June 2007
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Based on the theory of superhydrophobicity for low surface energy coatings, we describe a superhydrophobic antistiction silica coating for MEMS devices. The process uses a novel sol-gel process sequence with a eutectic liquid as a templating agent. The eutectic liquid displays negligible vapor pressure and very low melting point (12degC at ambient conditions) to reduce solvent loss during the high speed spincoating process. After a fluoroalkyl silane treatment, superhydrophobicity is achieved on the as-prepared silica thin film. The solvent can be extracted after the gelation and aging processes. Spin speed effect, eutectic liquid:TEOS ratio in the solution were studied in order to optimize the surface roughness to ensure excellent super-hydrophobicity. Comparison of the silica thin films with silicon pillar surfaces showed that superhydrophobicity for the traditional sol-gel derived silica films demonstrated significant improvement, especially under humid conditions. The AFM force curve obtained with a tipless probe showed that the interaction force is greatly reduced on a rough silica superhydrophobic surface. This result offers great potential to reduce stiction failures in MEMS devices.
  • Keywords
    ageing; atomic force microscopy; micromechanical devices; silicon compounds; sol-gel processing; solvent effects; stiction; AFM force curve; MEMS devices antistiction; SiO2; aging processes; eutectic liquid; fluoroalkyl silane treatment; gelation; high speed spincoating process; low surface energy coatings; sol-gel process; spin speed effect; superhydrophobic silica thin films; surface roughness; temperature 12 C; Atomic force microscopy; Coatings; Displays; Microelectromechanical devices; Rough surfaces; Silicon compounds; Solvents; Surface roughness; Thin film devices; Transistors;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-1253-6
  • Electronic_ISBN
    1-4244-1253-6
  • Type

    conf

  • DOI
    10.1109/HDP.2007.4283582
  • Filename
    4283582