DocumentCode
3182338
Title
Superhydrophobic Silica Thin Films Prepare by Sol-Gel Process for Antistiction of MEMS Devices
Author
Xiu, Yonghao ; Zhu, Lingbo ; Hess, Dennis W. ; Wong, C.P.
Author_Institution
Georgia Inst. of Technol., Atlanta
fYear
2007
fDate
26-28 June 2007
Firstpage
1
Lastpage
5
Abstract
Based on the theory of superhydrophobicity for low surface energy coatings, we describe a superhydrophobic antistiction silica coating for MEMS devices. The process uses a novel sol-gel process sequence with a eutectic liquid as a templating agent. The eutectic liquid displays negligible vapor pressure and very low melting point (12degC at ambient conditions) to reduce solvent loss during the high speed spincoating process. After a fluoroalkyl silane treatment, superhydrophobicity is achieved on the as-prepared silica thin film. The solvent can be extracted after the gelation and aging processes. Spin speed effect, eutectic liquid:TEOS ratio in the solution were studied in order to optimize the surface roughness to ensure excellent super-hydrophobicity. Comparison of the silica thin films with silicon pillar surfaces showed that superhydrophobicity for the traditional sol-gel derived silica films demonstrated significant improvement, especially under humid conditions. The AFM force curve obtained with a tipless probe showed that the interaction force is greatly reduced on a rough silica superhydrophobic surface. This result offers great potential to reduce stiction failures in MEMS devices.
Keywords
ageing; atomic force microscopy; micromechanical devices; silicon compounds; sol-gel processing; solvent effects; stiction; AFM force curve; MEMS devices antistiction; SiO2; aging processes; eutectic liquid; fluoroalkyl silane treatment; gelation; high speed spincoating process; low surface energy coatings; sol-gel process; spin speed effect; superhydrophobic silica thin films; surface roughness; temperature 12 C; Atomic force microscopy; Coatings; Displays; Microelectromechanical devices; Rough surfaces; Silicon compounds; Solvents; Surface roughness; Thin film devices; Transistors;
fLanguage
English
Publisher
ieee
Conference_Titel
High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on
Conference_Location
Shanghai
Print_ISBN
1-4244-1253-6
Electronic_ISBN
1-4244-1253-6
Type
conf
DOI
10.1109/HDP.2007.4283582
Filename
4283582
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