• DocumentCode
    3182493
  • Title

    Emerging Markets and Emerging Technologies

  • Author

    Pfahl, R.C., Jr. ; McElroy, James B., Sr.

  • Author_Institution
    Int. Electron. Manuf. Initiative (iNEMI), Herndon
  • fYear
    2007
  • fDate
    26-28 June 2007
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    Last year we discussed "Innovation Priorities" at this meeting. Since then iNEMI has completed its 2007 Roadmap. Our roadmap identifies that while digital convergence occurs ever more rapidly for existing markets, the key emerging markets are those with social value such as health care, energy, and security. To address both converging markets and emerging markets, iNEMI is focusing its project agenda on the technology to support miniaturization; high reliability medical electronics; and energy and the environment. The technology to meet these focus areas includes system in package, energy storage and conversion, sensors, advanced manufacturing processes, and advanced materials. This article not only highlights projects that iNEMI is establishing to support these focus areas, but also the gaps in technology that we have identified, from the 2007 roadmap, which may limit the growth of the electronics industry during the next decade. Given the limited resources available for industry, academia, and governments to apply, it is crucial that R&D efforts focus on these high priority knowledge gaps.
  • Keywords
    biomedical electronics; direct energy conversion; electron device manufacture; electronics industry; energy storage; research and development; system-in-package; R&D efforts; advanced manufacturing processes; advanced materials; digital convergence; electronics industry; energy conversion; energy storage; iNEMI; medical electronics; system in package; Consumer electronics; Electronics industry; Electronics packaging; Energy storage; Government; Manufacturing processes; Medical services; Security; Sensor systems; Technological innovation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-1253-6
  • Electronic_ISBN
    1-4244-1253-6
  • Type

    conf

  • DOI
    10.1109/HDP.2007.4283589
  • Filename
    4283589