Influence of Dopant on IMC Growth and Mechanical Properties of Sn-3.5Ag-0.7Cu Solder Joints

Author

Li, G.Y. ; Jiang, X.B. ; Li, B. ; Chen, P. ; Liao, R.

Author_Institution

South China Univ. of Technol., Guangzhou

fYear

2007

fDate

26-28 June 2007

Firstpage

1

Lastpage

4

Abstract

This work investigates the effects of Sb on IMC formation and mechanical properties of Sn-3.5Ag-0.7Cu lead-free solder joints. In this work, SEM is used to measure the thickness of intermetallic layer and observe the microstructural evolution of solder joint. The IMC phases are identified by EDX and XRD. Results show that there is a significant drop in IMC thickness when Sb is about 0.8 wt%. The tensile strength of the solder joints can be slightly improved by adding a small amount of Sb in Sn-Ag-Cu alloy system.

Keywords

X-ray chemical analysis; X-ray diffraction; copper alloys; electronics industry; scanning electron microscopy; silver alloys; solders; tensile strength; tin alloys; EDX; SEM; SnAgCu; XRD; intermetallic layer; lead-free solder joints; mechanical properties; microstructural evolution; tensile strength; Aging; Environmentally friendly manufacturing techniques; Intermetallic; Lead; Mechanical factors; Ovens; Scanning electron microscopy; Soldering; Testing; X-ray scattering;

fLanguage

English

Publisher

ieee

Conference_Titel

High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on

Conference_Location

Shanghai

Print_ISBN

1-4244-1253-6

Electronic_ISBN

1-4244-1253-6

Type

conf

DOI

10.1109/HDP.2007.4283594

Filename

4283594