Title :
Influence of Dopant on IMC Growth and Mechanical Properties of Sn-3.5Ag-0.7Cu Solder Joints
Author :
Li, G.Y. ; Jiang, X.B. ; Li, B. ; Chen, P. ; Liao, R.
Author_Institution :
South China Univ. of Technol., Guangzhou
Abstract :
This work investigates the effects of Sb on IMC formation and mechanical properties of Sn-3.5Ag-0.7Cu lead-free solder joints. In this work, SEM is used to measure the thickness of intermetallic layer and observe the microstructural evolution of solder joint. The IMC phases are identified by EDX and XRD. Results show that there is a significant drop in IMC thickness when Sb is about 0.8 wt%. The tensile strength of the solder joints can be slightly improved by adding a small amount of Sb in Sn-Ag-Cu alloy system.
Keywords :
X-ray chemical analysis; X-ray diffraction; copper alloys; electronics industry; scanning electron microscopy; silver alloys; solders; tensile strength; tin alloys; EDX; SEM; SnAgCu; XRD; intermetallic layer; lead-free solder joints; mechanical properties; microstructural evolution; tensile strength; Aging; Environmentally friendly manufacturing techniques; Intermetallic; Lead; Mechanical factors; Ovens; Scanning electron microscopy; Soldering; Testing; X-ray scattering;
Conference_Titel :
High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-1253-6
Electronic_ISBN :
1-4244-1253-6
DOI :
10.1109/HDP.2007.4283594
