• DocumentCode
    3182616
  • Title

    Comparison of neuronal excitation between extruded slab partial head model and full head model in subdural cortical stimulation

  • Author

    Hyeon Seo ; Donghyeon Kim ; Sung Chan Jun

  • Author_Institution
    Sch. of Inf. & Commun., Gwangju Inst. of Sci. & Technologyy, Gwangju, South Korea
  • fYear
    2013
  • fDate
    3-7 July 2013
  • Firstpage
    241
  • Lastpage
    244
  • Abstract
    Cortical stimulation (CS) is an appealing and emerging treatment for neurological disorders. CS is known to promote functional recovery effectively; however, its underlying mechanism and the optimal parameters for the effective treatment are not clearly understood. In this work, we developed a realistic three-dimensional full head and chest model for subdural CS. Our proposed model was compared at the neuron level with an existing simplified extruded slab partial head model depicting around precentral gyral cortex only. Each model was coupled with the pyramidal neuronal model in order to investigate an extent of neuronal excitation. We found that the crown of the cortex was the most excitable area in the unipolar stimulation, while in the bipolar stimulation, the lip and bank were excited more easily than other areas. Finally, it was evident that our proposed model was substantially different in excitation threshold from the existing simplified model, which is compelling to do computational CS study on more realistic head models.
  • Keywords
    medical disorders; neurophysiology; patient treatment; bipolar stimulation; extruded slab partial head model; neurological disorders; neuronal excitation; precentral gyral cortex; pyramidal neuronal model; subdural CS; subdural cortical stimulation; three-dimensional full chest model; three-dimensional full head model; Brain modeling; Computational modeling; Electrodes; Magnetic heads; Neurons; Slabs; Solid modeling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
  • Conference_Location
    Osaka
  • ISSN
    1557-170X
  • Type

    conf

  • DOI
    10.1109/EMBC.2013.6609482
  • Filename
    6609482