• DocumentCode
    3182681
  • Title

    A Method to Model MOSFET´s Second Breakdown Action for Circuit-Level ESD Simulation

  • Author

    Cui, Qiang ; Han, Yan ; Liou, Juin J. ; Dong, Shurong ; Si, Ruijun ; Peng, Cheng

  • Author_Institution
    Zhejiang Univ., Hangzhou
  • fYear
    2007
  • fDate
    26-28 June 2007
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    A method to exact the electrical parameters and model the "second breakdown" action of MOSFET\´s under ESD (electrostatic discharge) on circuit-level, using TCAD simulation, is presented. MOSFET is one of the most important ESD protection devices, and is widely used as I/O protection device in integrated circuits. The avalanche breakdown of the MOSFET can be simulated by TCAD tools and the circuit-level model has been presented. However, accurate modeling and insightful analyzing of the "second breakdown" action, which leads to the permanent failure of the MOSFET, is rarely reported. We present an accurate macro model of the MOSFET based on deep analyzing of the physical mechanism of the "second breakdown", using TCAD simulation. This macro model owns fine convergency and accuracy which are of importance to the simulation of the ESD protection ability of the ESD protection network on circuit and system level.
  • Keywords
    MOSFET; avalanche breakdown; electrostatic discharge; failure analysis; semiconductor device breakdown; semiconductor device models; technology CAD (electronics); ESD protection devices; I/O protection device; MOSFET second breakdown; TCAD simulation; avalanche breakdown; circuit-level ESD simulation; electrostatic discharge; integrated circuits; macro model; Avalanche breakdown; Breakdown voltage; Circuit simulation; Computational modeling; Contact resistance; Electric breakdown; Electrostatic discharge; Failure analysis; MOSFET circuits; Protection;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on
  • Conference_Location
    Shanghai
  • Print_ISBN
    1-4244-1253-6
  • Electronic_ISBN
    1-4244-1253-6
  • Type

    conf

  • DOI
    10.1109/HDP.2007.4283600
  • Filename
    4283600