Title :
Study of the Effect of Different Mounted Length of Capillary on Wire Bonding Strength
Author :
Yao, Gang ; Han, Lei
Author_Institution :
Coll. of the Electromech. Eng., Central South Univ., Changsha
Abstract :
In ultrasonic wire bonding, many factors influence the bonding quality. This article discussed the influence on the bonding quality at different capillary mounted length conditions. Experiment results show that bonding strength, current and voltage will differ at different mounted length of the capillary. The results of this article may be reference for the selection of the capillary mounted length in ultrasonic wire bonding process.
Keywords :
integrated circuit packaging; lead bonding; ultrasonic bonding; bonding quality; capillary mounted length conditions; microelectronics industry; packaging level; ultrasonic wire bonding strength; Aluminum; Bonding processes; Data analysis; Educational institutions; Length measurement; Statistics; Torque measurement; Vibrations; Voltage; Wire;
Conference_Titel :
High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-1252-8
Electronic_ISBN :
1-4244-1253-6
DOI :
10.1109/HDP.2007.4283607
