DocumentCode
3182853
Title
Study of the Effect of Different Mounted Length of Capillary on Wire Bonding Strength
Author
Yao, Gang ; Han, Lei
Author_Institution
Coll. of the Electromech. Eng., Central South Univ., Changsha
fYear
2007
fDate
26-28 June 2007
Firstpage
1
Lastpage
4
Abstract
In ultrasonic wire bonding, many factors influence the bonding quality. This article discussed the influence on the bonding quality at different capillary mounted length conditions. Experiment results show that bonding strength, current and voltage will differ at different mounted length of the capillary. The results of this article may be reference for the selection of the capillary mounted length in ultrasonic wire bonding process.
Keywords
integrated circuit packaging; lead bonding; ultrasonic bonding; bonding quality; capillary mounted length conditions; microelectronics industry; packaging level; ultrasonic wire bonding strength; Aluminum; Bonding processes; Data analysis; Educational institutions; Length measurement; Statistics; Torque measurement; Vibrations; Voltage; Wire;
fLanguage
English
Publisher
ieee
Conference_Titel
High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on
Conference_Location
Shanghai
Print_ISBN
1-4244-1252-8
Electronic_ISBN
1-4244-1253-6
Type
conf
DOI
10.1109/HDP.2007.4283607
Filename
4283607
Link To Document