DocumentCode :
3182960
Title :
Effect of Contact Interface in Transducer System in Ultrasonic Bonding
Author :
Zhili, Long ; Yunxin, Wu ; Lei, Han ; Jue, Zhong
Author_Institution :
Central South Univ., Changsha
fYear :
2007
fDate :
26-28 June 2007
Firstpage :
1
Lastpage :
4
Abstract :
The effect of contact interface on ultrasonic energy propagation is the common problem of all kinds of ultrasonic transducer. In ultrasonic bonding, contact interfaces between different parts are nonlinear factors, so they affect directly the ultrasonic energy propagation and bonding quality. By using finite element method and laser Doppler vibrometer, the effect of contact interface on the ultrasonic energy and vibration are investigated. It is found that, incorrect contact interfaces cause multiple vibration models and mix certain resonance frequencies, induce non-stable output of the ultrasonic energy, and lead to hysteresis response. All these would cause some bonding shortcomings such as lower bonding strengths and chip tilting.
Keywords :
Doppler measurement; finite element analysis; hysteresis; integrated circuit bonding; measurement by laser beam; ultrasonic bonding; ultrasonic transducers; vibration measurement; IC chip; bonding strength; chip tilting; contact interface; finite element method; hysteresis response; laser Doppler vibrometer; multiple vibration models; nonlinear factors; ultrasonic bonding; ultrasonic energy propagation; ultrasonic transducer system; Bonding; Gold; Inorganic materials; Optical propagation; Packaging; Piezoelectric transducers; Ultrasonic transducers; Ultrasonic variables measurement; Vibration measurement; Vibrometers; Contact interface; Ultrasonic bonding; Ultrasonic transducer system;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
High Density packaging and Microsystem Integration, 2007. HDP '07. International Symposium on
Conference_Location :
Shanghai
Print_ISBN :
1-4244-1252-8
Electronic_ISBN :
1-4244-1253-6
Type :
conf
DOI :
10.1109/HDP.2007.4283612
Filename :
4283612
Link To Document :
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